Lot Acceptance Testing
Die/wafer LAT testing to MIL-PRF-38534, 38535 and 19500 class K & H or to SCD/drawing or given specs
Bond pull / die shear
Hermetic seal fine and gross leak
Group Testing
Group testing per MIL-STD-883 method 5005 & MIL-PRF-38535 A, B, C, & D
Hermeticity - method 1014
Centrifuge - method 2001
Mechanical shock - method 2007
PIND - method 2020
Thermal vacuum testing
Electrical Probing
Wide range of electrical probing from -80C to +220C DC & AC parametric functionality tests. DC to 50 amps and 1000V in wafer or die form, including GaAs & GaN MMICs
Environmentals
Burn-in (static / dynamic), life test, method 1005 MIL-STD-883
RF
IC probing to high RF (67 GHz) s, y, z, abcd parameters
Radiation
RLAT - radiation lot acceptance testing
Total irradiation dose - method 1019.8
HDR 50-300 rad/s
LDR assume 10mrad/s
ELDRS, HDR (high), LDR (low)
SEP & LET linear energy threshold - 100 MeV-cm2/mg
Upscreening
Upscreening packaged parts for tighter tolerance
SEM & WLAT
Cross section analysis, decap
Programming
PAL, PROM, EPROM programming and testing