Capabilities

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Supplying die and wafers for hi-rel applications with full traceability. Inspection per MIL-STD-883 /750 2010/B visual for all outgoing product.

Offering solutions for form, fit, function replacements to SCD or datasheet and screening testing as well as reverse engineering for low-cost DMSMS and obsolescent solutions

Lot acceptance testing per MIL-STD-883/750, device characterization, screening, binning, S-parameters to 67 GHz, environmentals and accelerated life -80C to +200C

Power transistor and GaAs/GaN/MMIC heat sink attachments. Design and manufacturing of test fixtures for DUTs. Vacuum, heated, cooled, die, dip, etc.

Small batch, low-rate initial productions in IC DIPs, TO cans.  Ball, wedge (90 & 45) and ribbon - .7-3 mil wire (Au, Al, Cu) 

Precision wafer dicing and die singulation for Si, GaAs, GaN, and Sapphire to gel-pak or waffle pack carriers